Method for electroless nickel-phosphorous alloy deposition onto flexible substrates
View Patent ↗The present invention relates to a method for electroless deposition of a bendable nickel-phosphorous alloy layer onto flexible substrates such as flexible printed circuit boards and the like. The nickel-phosphorous alloy layer is deposited from an aqueous plating bath comprising nickel ions, hypophosphite ions, at least one complexing agent and a grain refining additive selected from the group consisting of formaldehyde and formaldehyde precursors. The nickel-phosphorous alloy layers obtained have a columnar microstructure oriented perpendicular to the flexible substrate and are sufficiently bendable.
1. A method for electroless deposition of a bendable nickel-phosphorous alloy layer onto a flexible substrate, comprising, in this order, the steps
i. providing a flexible substrate having attached to at least one side a copper circuitry,
ii. contacting the flexible substrate with an aqueous plating bath comprising
1. nickel ions,
2. hypophosphite ions,
3. at least one complexing agent and
4. a grain refining additive selected from the group consisting of formaldehyde and formaldehyde precursors,
wherein the contacting deposits the bendable nickel-phosphorous alloy layer onto the copper circuitry attached to at least one side of the flexible substrate.
2. The method for electroless deposition of a bendable nickel-phosphorous alloy layer according to claim 1 wherein the flexible substrate is a flexible printed circuit board.
3. The method for electroless deposition of a bendable nickel-phosphorous alloy layer according to claim 1 wherein the concentration of nickel ions in the aqueous plating bath ranges from 1 to 18 g/l.
4. The method for electroless deposition of a bendable nickel-phosphorous alloy layer according to claim 1 the concentration of hypophosphite ions ranges from 2 to 60 g/l.
5. The method for electroless deposition of a bendable nickel-phosphorous alloy layer according to claim 1 wherein the concentration of the at least one complexing agent ranges from 1 to 200 g/l.
6. The method for electroless deposition of a bendable nickel-phosphorous alloy layer according to claim 1 wherein the at least one complexing agent is selected from the group consisting of carboxylic acids, hydroxycarboxylic acids, and aminocarboxylic acids.
7. The method for electroless deposition of a bendable nickel-phosphorous alloy layer according to claim 1 wherein the concentration of the grain refining additive ranges from 0.001 to 1.0 g/l.
8. The method for electroless deposition of a bendable nickel-phosphorous alloy layer according to claim 1 wherein the formaldehyde precursor is selected from the group consisting of acetals, hemiacetals, aminals, and N,O-acetals.
9. The method for electroless deposition of a bendable nickel-phosphorous alloy layer according to claim 1 wherein the formaldehyde precursor is selected from the group consisting of dimethylol glycol, sodium hydroxymethylglycinate, 1,3-bis(hydroxymethyl) 5,5-dimethyl-imidazolidine-2,4-dione, 1,3,5,7-tetraazatricyclo[3.3.1.1 3,7 ]decane, benzylhemiformal, 2-bromo-2-nitropropane-1,3-diol, 5-bromo-5-nitro-1,3-dioxane, 1,3-bis(hydroxyl-methyl)-1-(1,3,4-tris(hydroxymethyl)-2,5-dioxoimidazolidin-4-yl)urea, 1,1′-methylenebis{3-[1-(hydroxymethyl)-2,5-dioxoimidazolidin-4-yl]-urea}, 3,5,7-triaza-1-azoniatricyclo-[3.3.1.1 3,7 ]-decane-1-(3-chloro-2-propenyl)-chloride, tetramethylolglycoluril, 1,3-bis(hydroxymethyl)2-imidazolidinone, 1,3-bis(hydroxyl-methyl)urea, 2,2,2-trichloroethane-1,1-diol, and 5,5-dimethyl-1,3-dioxane.
10. The method for electroless deposition of a bendable nickel-phosphorous alloy layer according to claim 1 wherein the aqueous plating bath is held at a temperature between 40 and 95° C. during deposition of the nickel-phosphorous alloy.
11. The method for electroless deposition of a bendable nickel-phosphorous alloy layer according to claim 1 wherein the flexible substrate is contacted with the aqueous plating bath for 1 to 60 min.