IP Library › Granted Patent US 822,724
Granted Patent S1
US 822,724 · App. 29/575,984 · Granted Jul 10, 2018

Device for metal deposition

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Quick Facts
Patent No.
US 822,724
App. No.
29/575,984
Granted
Jul 10, 2018
Kind
S1
Claims (1)

The ornamental design for a device for metal deposition, as shown and described.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Aug 18, 2022
From: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
To: ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH); ATOTECH USA, LLC
Reel/Frame 061521/0103 →
SECURITY INTEREST Recorded Mar 18, 2021
From: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA, LLC
To: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
Reel/Frame 055650/0093 →
RELEASE OF SECURITY INTEREST Recorded Mar 18, 2021
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA, LLC
Reel/Frame 055653/0714 →
SECURITY INTEREST Recorded Feb 1, 2017
From: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA INC
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 041590/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 30, 2016
From: HÄNSCHEN, RALF
To: ATOTECH DEUTSCHLAND GMBH
Reel/Frame 039590/0497 →