Wafer-like substrate processing method and apparatus
The present invention refers to a method for processing a wafer like substrate using a touching gripper and a touchless gripper. Furthermore, the present invention refers to an apparatus for processing a wafer-like substrate containing a touching gripper and a touchless gripper. Additionally, the present invention refers to the use of an inventive apparatus to process a wafer-like substrate.
1. A wafer substrate processing apparatus comprising a loading device, an alignment device, a connecting device, a treatment device, a post-treatment device, a storing device, and a robot arm having a touching gripper and a touchless gripper, both the touching gripper and the touchless gripper are capable of transporting a wafer substrate, wherein:
the touchless gripper or the touching gripper are capable of transporting the wafer substrate from the loading device to the alignment device, which is capable of aligning the wafer substrate;
the touching gripper is capable of transporting an aligned wafer substrate from the alignment device to the connecting device, which is capable of fastening the aligned wafer substrate in a substrate holder and unfastening a treated wafer substrate from the substrate holder;
the touching gripper is capable of transporting the substrate holder from the connecting device to the treatment device, which is capable of treating the wafer substrate, and back to the connecting device;
the touching gripper is capable of transporting the treated wafer substrate from the connecting device to the post-treatment device; and
the touchless gripper is capable of transporting the post-treated wafer substrate from the post-treatment device to the storing device or back to the loading device.
2. The wafer substrate processing apparatus according to claim 1 , wherein the treatment device is for wet treatment, wherein the wafer substrate is treated by one or more of a) chemical or electrolytic metal deposition, b) chemical or electrolytic etching and c) chemical or electrolytic cleaning.
3. The wafer substrate processing apparatus according to claim 1 , wherein the wafer substrate comprises at least one surface to be treated and the touching gripper or the touchless gripper is capable to grip the wafer substrate on the at least one surface to be treated during transport.
4. The wafer substrate processing apparatus according to claim 1 , wherein the touchless gripper is a Bernoulli gripper.
5. The wafer substrate processing apparatus according to claim 1 , wherein the touching gripper and the touchless gripper are reversibly attached to the robot arm.