Patent Assignment
Reel/Frame 048365/0953
Assignment of Assignor's Interest
Recorded: 2019-02-19
Pages: 8
Assignors
RAUENBUSCH, RALPH
Executed: 2019-01-28
BUSSENIUS, TOBIAS
Executed: 2019-02-14
BUCHBERGER, DANIEL
Executed: 2019-01-18
WEINHOLD, RAY
Executed: 2019-01-11
Assignee
ATOTECH DEUTSCHLAND GMBH
ERASMUSSTRASSE 20, BERLIN, 10553, GERMANY
Covered Property
(1)
Wafer-Like Substrate Processing Method and Apparatus
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Mar 18, 2021
From: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA, LLC
To: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
Reel/Frame 055650/0093 →
Release of Security Interest
Aug 18, 2022
From: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
To: ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH); ATOTECH USA, LLC
Reel/Frame 061521/0103 →