Method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer
The present invention relates to a method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer, the method comprising in this order the steps: (i) providing a non-conductive substrate comprising on at least one side said surface, said surface having a total surface area of copper or copper alloy, (ii) contacting said substrate comprising said surface with an acidic aqueous non-etching protector solution comprising (ii-a) one or more than one amino azole, (ii-b) one or more than one organic acid and/or salts thereof, (ii-c) one or more than one peroxide in a total amount of 0.4 wt-% or less, based on the total weight of the protector solution, and (ii-d) inorganic acids in a total amount of 0 to 0.01 wt-%, based on the total weight of the protector solution, wherein during step (ii) the total surface area of said surface is not increased upon contacting with the protector solution.
1. A method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer, the method comprising in this order the steps:
(i) providing a non-conductive substrate comprising on at least one side said surface, said surface having a total surface area of copper or copper alloy,
(ii) contacting said substrate comprising said surface with an acidic aqueous non-etching protector solution comprising
(ii-a) one or more than one amino azole,
(ii-b) one or more than one organic acid and/or salts thereof,
(ii-c) one or more than one peroxide in a total amount of 0.4 wt-% or less, based on the total weight of the protector solution, and
(ii-d) one or more than one inorganic acid in a total amount of 0 to 0.01 wt %, based on the total weight of the protector solution,
wherein during step (ii) the total surface area of said surface is not increased upon contacting with the protector solution, and
wherein the protector solution is substantially free of chloride and fluoride ions.
2. The method of claim 1 , wherein in step (i) the surface of copper or copper alloy comprises a nano-roughened surface layer obtained by
oxidizing Cu-(0) into Cu—(I) and Cu-(II), respectively, and subsequently
reducing at least partly this Cu—(I) and Cu-(II), respectively, into Cu-(0).
3. The method of claim 2 , wherein in step (i) the nano-roughened surface layer has a maximum layer thickness of 500 nm or less.
4. The method according to claim 1 , wherein during step (ii) the one or more than one amino azole adsorbs on said surface of copper or copper alloy such that a protected surface of copper or copper alloy results.
5. The method according to claim 1 , wherein in the acidic aqueous non-etching protector solution the molar ratio of all peroxides to all amino azoles is 1 or less.
6. The method according to claim 1 , wherein the one or more than one peroxide comprises hydrogen peroxide.
7. The method according to claim 1 , wherein the total amount of the one or more than one peroxide is 0.35 wt-% or less, based on the total weight of the protector solution.
8. The method according to claim 1 , wherein the acidic aqueous non-etching protector solution has a pH in the range from 2.5 to 6.
9. The method according to claim 1 , wherein the one or more than one amino azole is selected from the group consisting of amino tetrazole, amino triazole, substituted amino triazole, and substituted amino tetrazole.
10. The method according to claim 1 , wherein the one or more than one amino azole is present in a total amount of 2.0 wt-% or less, based on the total weight of the protector solution.
11. The method according to claim 1 , wherein the total amount of organic acid residue anions of the one or more than one organic acid and salts thereof is 4 wt-% or less, based on the total weight of the protector solution.
12. The method according to claim 1 , wherein in step (ii) the contacting is carried out for 5 seconds to 600 seconds.
13. The method according to claim 1 further comprising the additional step
(iii) laminating the organic layer onto the substrate obtained after step (ii) such that the surface of copper or copper alloy contacted with the acidic aqueous non-etching protector solution during step (ii) is in contact with the organic layer.
14. The method of claim 13 , wherein the organic layer in step (iii) is a build-up layer.
15. An acidic aqueous non-etching protector solution comprising
(a) one or more than one amino azole,
(b) one or more than one organic acid and/or salts thereof,
(c) one or more than one peroxide in a total amount of 0.4 wt-% or less, based on the total weight of the protector solution, and
(d) inorganic acids in a total amount of 0 to 0.01 wt-%, based on the total weight of the protector solution,
wherein in the acidic aqueous non-etching protector solution the molar ratio of all peroxides to all amino azoles is 1 or less, and
wherein the protector solution is substantially free of chloride and fluoride ions.
16. The method according to claim 1 , wherein, in the acidic aqueous non-etching protector solution, molar ratio of all peroxides to all amino azoles is 0.6 or less.
17. The method according to claim 1 , wherein the total amount of the one or more than one peroxide is 0.20 wt-% or less, based on the total weight of the protector solution.
18. The method according to claim 1 , wherein the one or more than one amino azole comprises 5-amino tetrazole.
19. The method according to claim 1 , wherein the one or more than one amino azole is present in a total amount of 1.0 wt-% or less, based on the total weight of the protector solution.
20. The method of claim 1 , wherein the protector solution is substantially free of halide ions.