IP Library Assignment 054250/0410
Patent Assignment
Reel/Frame 054250/0410

Assignment of Assignor's Interest

Recorded: 2020-11-03 Pages: 12
Assignors
LÜTZOW, NORBERT
Executed: 2020-09-01
CHO, WONJIN
Executed: 2020-09-01
HONDA, TOSHIO
Executed: 2020-09-02
TEWS, DIRK
Executed: 2020-09-01
LAGER, MARKKU
Executed: 2020-09-01
TANG, FELIX
Executed: 2020-09-04
KLOPPISCH, MIRKO
Executed: 2020-10-05
HAHN, AARON
Executed: 2020-09-05
SCHMIDT, GABRIELA
Executed: 2020-10-07
THOMS, MARTIN
Executed: 2020-09-01
Assignee
ATOTECH DEUTSCHLAND GMBH
ERASMUSSTRASSE 20, BERLIN, 10553, GERMANY
Covered Property (1)
A Method for Increasing Adhesion Strength Between a Surface of Copper or Copper Alloy and an Organic Layer
Application: 17/052,545 →
Publication: US 2021/0251085
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Mar 18, 2021
From: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA, LLC
To: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
Reel/Frame 055650/0093 →
Release of Security Interest Aug 18, 2022
From: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
To: ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH); ATOTECH USA, LLC
Reel/Frame 061521/0103 →