Patent Assignment
Reel/Frame 049391/0842
Assignment of Assignor's Interest
Recorded: 2019-06-06
Pages: 4
Assignors
TEAN, KE YAN
Executed: 2019-05-30
BEMMERL, THOMAS
Executed: 2019-06-04
GAN, THAI KEE
Executed: 2019-05-30
KASSIM, AZLINA
Executed: 2019-05-30
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-15, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Semiconductor Package with Space Efficient Lead and Die Pad Design