Patent Assignment
Reel/Frame 049392/0642
Assignment of Assignor's Interest
Recorded: 2019-06-06
Pages: 7
Assignors
HWANG, CHANG SUN
Executed: 2019-02-28
SEOK, HAN SOL
Executed: 2019-02-28
KANG, HYUN KU
Executed: 2019-02-28
KWON, BYOUNG HO
Executed: 2019-02-28
MIN, CHUNG KI
Executed: 2019-02-28
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device with a Stacked Structure and a Capping Insulation Layer