Patent Assignment
Reel/Frame 049392/0659
Assignment of Assignor's Interest
Recorded: 2019-06-06
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Forming Metal Cap Layers to Improve Performance of Semiconductor Structure
Patent:
10,818,768 →
Application:
16/427,102 →