Patent Assignment
Reel/Frame 049395/0862
Assignment of Assignor's Interest
Recorded: 2019-06-06
Pages: 4
Assignor
MORITA, TSUYOSHI
Executed: 2019-01-31
Assignee
SUMCO CORPORATION
2-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 1058634, JAPAN
Covered Property
(1)
Method of Polishing Silicon Wafer Including Notch Polishing Process and Method of Producing Silicon Wafer