Patent Assignment
Reel/Frame 049408/0214
Assignment of Assignor's Interest
Recorded: 2019-06-06
Pages: 2
Assignors
SONG, JIE
Executed: 2019-05-23
XU, XIAOFENG
Executed: 2019-05-23
LIM, BENG BENG
Executed: 2019-05-23
Assignee
DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTD
4 KAKI BUKIT AVENUE 1, #05 - 04, SINGAPORE, 417939, SINGAPORE
Covered Property
(1)
Heat-Dissipating Semiconductor Package Including a Plurality of Metal Pins Between First and Second Encapsulation Members