Patent Assignment
Reel/Frame 049408/0525
Assignment of Assignor's Interest
Recorded: 2019-06-07
Pages: 10
Assignors
HUANG, CHIEN-MEI
Executed: 2019-06-05
WANG, SHIH-YU
Executed: 2019-06-05
LIN, I-TING
Executed: 2019-06-05
HUANG, WEN HUNG
Executed: 2019-06-05
SU, YUH-SHAN
Executed: 2019-06-05
LEE, CHIH-CHENG
Executed: 2019-06-05
TIEN, HSING KUO
Executed: 2019-06-05
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package with Stress Buffering Layer and Method for Manufacturing the Same