Patent Assignment
Reel/Frame 049430/0715
Assignment of Assignor's Interest
Recorded: 2019-06-11
Pages: 5
Assignors
TSAI, PO-HAO
Executed: 2019-06-03
LIU, HSIEN-WEN
Executed: 2019-05-31
JENG, SHIN-PUU
Executed: 2019-06-03
LIN, MENG-LIANG
Executed: 2019-06-03
PENG, SHIH-YUNG
Executed: 2019-06-03
HUNG, SHIH-TING
Executed: 2019-06-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Structure and Formation Method of Package Structure with Fan-Out Structure