Patent Assignment
Reel/Frame 049432/0278
Assignment of Assignor's Interest
Recorded: 2019-06-11
Pages: 7
Assignors
SANKMAN, ROBERT L
Executed: 2019-05-31
TADAYON, POOYA
Executed: 2019-06-03
TANG, WEIHUA
Executed: 2019-06-03
JHA, CHANDRA M
Executed: 2019-05-31
WAN, ZHIMIN
Executed: 2019-05-31
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Thermal Spreading Management of 3D Stacked Integrated Circuits