Patent Assignment
Reel/Frame 049435/0389
Assignment of Assignor's Interest
Recorded: 2019-06-11
Pages: 7
Assignors
LIM, MEE-HYUN
Executed: 2019-05-09
KIM, SUNG-YEOL
Executed: 2019-05-09
CHO, SEONG-KEUN
Executed: 2019-05-09
JOO, WON-DON
Executed: 2019-05-09
KIM, JAE-HONG
Executed: 2019-05-09
KIM, TAEK-JIN
Executed: 2019-05-09
LEE, KYUNG-MIN
Executed: 2019-05-09
LEE, SANG-MIN
Executed: 2019-05-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Testing an Interconnection Substrate and Apparatus for Performing the Same