Patent Assignment
Reel/Frame 049465/0568
Assignment of Assignor's Interest
Recorded: 2019-06-14
Pages: 4
Assignors
KUO, HUNG-JUI
Executed: 2019-05-22
TSAI, HUI-JUNG
Executed: 2019-05-22
LIN, KENG-HAN
Executed: 2019-05-22
PENG, JYUN-SIANG
Executed: 2019-05-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Packages and Methods of Manufacturing the Same