Patent Assignment
Reel/Frame 049465/0599
Assignment of Assignor's Interest
Recorded: 2019-06-14
Pages: 4
Assignors
CHEN, HSIEN-WEI
Executed: 2019-06-06
YANG, CHING-JUNG
Executed: 2019-06-06
CHEN, JIE
Executed: 2019-06-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Semiconductor Packaging Structure Including Interconnection to Probe Pad with Probe Mark and Method of Manufacturing the Same