Patent Assignment
Reel/Frame 049469/0054
Assignment of Assignor's Interest
Recorded: 2019-06-14
Pages: 3
Assignors
SEO, YOON SEOK
Executed: 2019-05-28
PARK, DAE HYUN
Executed: 2019-05-28
LEE, SANG JONG
Executed: 2019-05-28
KIM, CHUL KYU
Executed: 2019-05-28
LIM, JAE HYUN
Executed: 2019-05-28
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Having Through-Hole Including Shielding Wiring Structure