Patent Assignment
Reel/Frame 049503/0399
Assignment of Assignor's Interest
Recorded: 2019-06-18
Pages: 7
Assignors
LIM, JIN-YOUNG
Executed: 2019-01-17
PARK, JAE-HO
Executed: 2019-01-17
BAEK, SANG-HOON
Executed: 2019-01-17
YOU, HYEON-GYU
Executed: 2019-01-17
LEE, DAL-HEE
Executed: 2019-01-17
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Including Multiple-Height Cell and Method of Manufacturing the Integrated Circuit