IP Library Assignment 049507/0909
Patent Assignment
Reel/Frame 049507/0909

Assignment of Assignor's Interest

Recorded: 2019-06-18 Pages: 3
Assignor
LINDBERG, HANS
Executed: 2019-06-11
Assignee
OSRAM OPTO SEMICONDUCTORS GMBH
LEIBNIZSTRASSE 4, REGENSBURG, 93055, GERMANY
Covered Property (1)
Heating Apparatus, Method and System for Producing Semiconductor Chips in the Wafer Assembly
Application: 16/340,364 →
Publication: US 2019/0244839
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 3, 2020
From: OSRAM OPTO SEMICONDUCTORS GMBH
To: OSRAM OLED GMBH
Reel/Frame 051464/0504 →
Merger Feb 17, 2026
From: OSRAM OLED GMBH
To: AMS-OSRAM INTERNATIONAL GMBH
Reel/Frame 074881/0104 →