Patent Assignment
Reel/Frame 049518/0531
Assignment of Assignor's Interest
Recorded: 2019-06-19
Pages: 6
Assignors
PARK, SANG SICK
Executed: 2019-03-12
KANG, UN BYOUNG
Executed: 2019-03-12
MIN, TAE HONG
Executed: 2019-03-12
LEE, TEAK HOON
Executed: 2019-03-12
HWANG, JI HWAN
Executed: 2019-03-12
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Having Recessed Adhesive Layer Between Stacked Chips