Patent Assignment
Reel/Frame 049522/0353
Assignment of Assignor's Interest
Recorded: 2019-06-19
Pages: 4
Assignors
HUANG, KUAN-YU
Executed: 2019-05-24
KUO, LI-CHUNG
Executed: 2019-05-29
HUANG, SUNG-HUI
Executed: 2019-05-27
HOU, SHANG-YUN
Executed: 2019-05-28
CHEN, TSUNG-YU
Executed: 2019-05-24
HUANG, CHIEN-YUAN
Executed: 2019-05-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6 HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Method of Forming the Same