Patent Assignment
Reel/Frame 049523/0448
Assignment of Assignor's Interest
Recorded: 2019-06-19
Pages: 4
Assignor
KAMEI, KOJI
Executed: 2019-06-10
Assignee
SHOWA DENKO K.K.
13-9, SHIBADAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
SiC WAFER DEFECT MEASURING METHOD, REFERENCE SAMPLE, AND METHOD OF MANUFACTURING SiC EPITAXIAL WAFER
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.