Patent Assignment
Reel/Frame 049526/0727
Assignment of Assignor's Interest
Recorded: 2019-06-19
Pages: 3
Assignor
SUKEKAWA, MITSUNARI
Executed: 2018-05-21
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83716-9632
Covered Property
(1)
Semiconductor Memory Device Having Plural Chips Connected by Hybrid Bonding Method