Patent Assignment
Reel/Frame 049544/0135
Assignment of Assignor's Interest
Recorded: 2019-06-20
Pages: 3
Assignor
YEH, CHANG-LIN
Executed: 2019-06-17
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package and Method for Manufacturing the Same