Patent Assignment
Reel/Frame 049545/0346
Assignment of Assignor's Interest
Recorded: 2019-06-20
Pages: 4
Assignors
CHIANG, TSUNG-HSIEN
Executed: 2019-04-25
TU, HSIEN-MING
Executed: 2019-04-26
TSAI, HAO-YI
Executed: 2019-06-04
KUO, TIN-HAO
Executed: 2019-05-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Method of Manufacturing Semiconductor Package