IP Library Assignment 049550/0549
Patent Assignment
Reel/Frame 049550/0549

Assignment of Assignor's Interest

Recorded: 2019-06-21 Pages: 4
Assignors
SEDDON, MICHAEL J.
Executed: 2018-04-11
NEYER, THOMAS
Executed: 2018-04-20
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 EAST MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Semiconductor Wafer Thinning Systems and Related Methods
Application: 16/448,540 →
Publication: US 2019/0326117
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 23, 2019
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 050156/0421 →
Security Interest Jul 13, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; GTAT CORPORATION
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064271/0971 →
Release of Security Interest in Patents Previously Recorded at Reel 050156, Frame 0421 Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0639 →