IP Library Assignment 049558/0822
Patent Assignment
Reel/Frame 049558/0822

Assignment of Assignor's Interest

Recorded: 2019-06-21 Pages: 4
Assignors
NI, CHING-YU
Executed: 2019-06-11
LIU, YOUNG-WAY
Executed: 2019-06-11
Assignee
HON HAI PRECISION INDUSTRY CO., LTD.
66, CHUNG SHAN ROAD, TU-CHENG DIST., NEW TAIPEI, TAIWAN
Covered Property (1)
Semiconductor Packaging Structure and Method of Fabricating Same
Application: 16/448,098 →
Publication: US 2020/0294959
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 15, 2020
From: HON HAI PRECISION INDUSTRY CO., LTD.
To: SOCLE TECHNOLOGY CORP.
Reel/Frame 054057/0981 →
Assignment of Assignor's Interest Mar 18, 2022
From: SOCLE TECHNOLOGY CORP.
To: KORE SEMICONDUCTOR CO., LTD.
Reel/Frame 059300/0894 →