Patent Assignment
Reel/Frame 049572/0363
Assignment of Assignor's Interest
Recorded: 2019-06-25
Pages: 14
Assignors
SU, SHIH-WEI
Executed: 2019-06-21
CHANG, HAO-HSUAN
Executed: 2019-06-21
CHANG, CHIH-WEI
Executed: 2019-06-21
CHENG, CHI-HSUAN
Executed: 2019-06-21
CHIEN, TING-AN
Executed: 2019-06-21
TSAI, BIN-SIANG
Executed: 2019-06-21
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Device and Fabrication Method Thereof