Patent Assignment
Reel/Frame 049576/0532
Assignment of Assignor's Interest
Recorded: 2019-06-25
Pages: 3
Assignors
TSAI, TZU-CHONG
Executed: 2019-06-11
KO, PING-CHENG
Executed: 2019-06-11
YANG, JHIH-YUAN
Executed: 2019-06-12
LIU, FANG-YU
Executed: 2019-06-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Semiconductor Die Carrier Structure