Patent Assignment
Reel/Frame 049586/0547
Corrective Assignment to Correct the Second Assignee's Street Address Previously Recorded at Reel: 049433 Frame: 0252. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2019-06-25
Pages: 6
Assignors
JIN, YU-FENG
Executed: 2019-04-25
MA, SHENG-LIN
Executed: 2019-04-30
CHIU, YI-HSIANG
Executed: 2019-04-25
LEE, HUNG-PING
Executed: 2019-04-25
GONG, DAN
Executed: 2019-04-30
Assignees
J-METRICS TECHNOLOGY CO., LTD.
9F, NO. 102, SEC. 3, MINQUAN E. RD., SONGSHAN DIST., TAIPEI CITY, 105, TAIWAN
PEKING UNIVERSITY SHENZHEN GRADUATE SCHOOL
SCHOOL OF ELECTRONIC AND COMPUTER ENGINEERING, PEKING UNIVERSITY SHENZHEN GRADUATE SCHOOL, PEKING UNIVERSITY, SHENZHEN, 518055, CHINA
Covered Property
(1)
Wafer Scale Ultrasonic Sensor Assembly and Method for Manufacturing the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 11, 2019
From: JIN, YU-FENG; MA, SHENG-LIN; CHIU, YI-HSIANG; LEE, HUNG-PING
To: J-METRICS TECHNOLOGY CO., LTD.; PEKING UNIVERSITY SHENZHEN GRADUATE SCHOOL
Reel/Frame 049433/0252 →
Assignment of Assignor's Interest
Apr 26, 2023
From: J-METRICS TECHNOLOGY CO., LTD.
To: SONICMEMS (ZHENGZHOU) TECHNOLOGY CO.,LTD
Reel/Frame 063445/0963 →
Assignment of Assignor's Interest
May 10, 2023
From: J-METRICS TECHNOLOGY CO., LTD.
To: SONICMEMS (ZHENGZHOU) TECHNOLOGY CO.,LTD.
Reel/Frame 063600/0340 →