Patent Assignment
Reel/Frame 049605/0557
Assignment of Assignor's Interest
Recorded: 2019-06-27
Pages: 4
Assignors
HUNG, LI-CHUN
Executed: 2019-06-24
LEE, CHIEN-CHEN
Executed: 2019-06-24
TU, HSIU-WEN
Executed: 2019-06-24
Assignee
KINGPAK TECHNOLOGY INC.
NO.84, TAI-HO RD., CHU-PEI, HSIN-CHU COUNTY, 302, TAIWAN
Covered Property
(1)
Chip-Scale Sensor Package Structure
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.