Patent Assignment
Reel/Frame 049617/0157
Assignment of Assignor's Interest
Recorded: 2019-06-27
Pages: 7
Assignors
SIROCKA, NATHAN J.
Executed: 2016-01-13
TANADI, TRISMARDAWI
Executed: 2016-01-13
PROESCHOLDT, ANDREW D.
Executed: 2016-01-13
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Semiconductor Devices with Duplicated Die Bond Pads and Associated Device Packages and Methods of Manufacture