Patent Assignment
Reel/Frame 049623/0406
Assignment of Assignor's Interest
Recorded: 2019-06-28
Pages: 4
Assignors
CHENG, CHIH-KAI
Executed: 2019-06-18
LIN, TSUNG-SHU
Executed: 2019-06-18
CHEN, TSUNG-YU
Executed: 2019-06-18
HU, HSIEN-PIN
Executed: 2019-06-18
WEI, WEN-HSIN
Executed: 2019-06-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure Having Line Connected via Portions