Patent Assignment
Reel/Frame 049626/0498
Assignment of Assignor's Interest
Recorded: 2019-06-28
Pages: 4
Assignors
CHIANG, KUO-CHENG
Executed: 2019-06-17
HSU, CHUNG-WEI
Executed: 2019-06-18
CHU, LUNG-KUN
Executed: 2019-06-18
HUANG, MAO-LIN
Executed: 2019-06-18
YU, JIA-NI
Executed: 2019-06-18
WANG, CHIH-HAO
Executed: 2019-06-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Methods of Fabricating Semiconductor Devices for Tightening Spacing Between Nanosheets in Gaa Structures and Structures Formed Thereby