Patent Assignment
Reel/Frame 049641/0187
Assignment of Assignor's Interest
Recorded: 2019-07-01
Pages: 2
Assignors
LEE, CHIEN-WEI
Executed: 2019-06-27
LIN, CHE-YU
Executed: 2019-06-27
SUNG, HSUEH-CHANG
Executed: 2019-06-27
YEO, YEE-CHIA
Executed: 2019-06-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
FinFET Device and Method of Forming Same