Patent Assignment
Reel/Frame 049642/0160
Assignment of Assignor's Interest
Recorded: 2019-07-01
Pages: 5
Assignors
BONAM, RAVI K.
Executed: 2019-07-01
FAROOQ, MUKTA GHATE
Executed: 2019-06-25
GUPTA, DINESH
Executed: 2019-06-25
KELLY, JAMES
Executed: 2019-06-26
SIKKA, KAMAL K.
Executed: 2019-06-25
RUBIN, JOSHUA M.
Executed: 2019-06-25
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Semiconductor Wafer Having Trenches with Varied Dimensions for Multi-Chip Modules