Patent Assignment
Reel/Frame 049649/0283
Assignment of Assignor's Interest
Recorded: 2019-07-02
Pages: 5
Assignors
BARNETTE, JAMAICA LAQUAY
Executed: 2019-06-28
EVANS, DOUGLAS
Executed: 2019-06-27
TAILOR, DIPAK
Executed: 2019-07-01
TOTTEN, BRIAN CHRISTOPHER
Executed: 2019-06-27
Assignee
LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
151, LORONG CHUAN, #02-01, NEW TECH PARK, 556741, SINGAPORE
Covered Property
(1)
Systems and Methods for Cooling Computing Device Expansion Modules Based on Airflow Rates
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 21, 2025
From: LENOVO GLOBAL TECHNOLOGIES INTERNATIONAL LIMITED
To: LENOVO GLOBAL TECHNOLOGIES SWITZERLAND INTERNATIONAL GMBH
Reel/Frame 070292/0001 →
Assignment of Assignor's Interest
Feb 21, 2025
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE LTD.
To: LENOVO GLOBAL TECHNOLOGIES INTERNATIONAL LTD.
Reel/Frame 070292/0223 →