IP Library Granted Patent US 11,321,497
Granted Patent B2
US 11,321,497 · App. 16/456,650 · Granted May 3, 2022

Systems and methods for cooling computing device expansion modules based on airflow rates

Inventors: Jamaica LaQuay Barnette (Research Triangle Park, NC); Douglas Evans (Research Triangle Park, NC); Dipak Tailor (Research Triangle Park, NC); Brian Christopher Totten (Research Triangle Park, NC)
Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
G06F30/00
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Quick Facts
Patent No.
US 11,321,497
App. No.
16/456,650
Granted
May 3, 2022
Kind
B2
Abstract

Systems and methods for cooling computing device expansion modules based on airflow rates are disclosed. According to an aspect, a method includes determining airflow rates in areas available for operable connection of expansion modules within a computing device during operation of the computing device. The method also includes determining expected power consumption of the expansion modules. Further, the method includes presenting placement of the expansion modules in the areas based on the determined airflow rates and the expected power consumption of the expansion modules.

Claims (35)

1. A method comprising:

determining airflow rates in areas available for operable connection of expansion modules within a computing device during operation of the computing device;

operating the computing device at a predetermined operating condition;

measuring actual power consumption of the expansion modules in a first arrangement within the areas during operation of the computing device, wherein the actual power consumption is measured at the predetermined operating condition;

determining a second arrangement of the expansion modules within the areas based on the measured actual power consumption and the determined airflow rates; and

presenting, on a user interface, indication of placement of the expansion modules in the second arrangement.

2. The method of claim 1 , wherein determining airflow rates comprises using a sensor to measure the airflow rates.

3. The method of claim 1 , wherein an expansion module comprises one of a peripheral component interconnect (PCI)-compatible expansion module, a field-programmable gate array (FPGA), a graphics processing unit (GPU), a network interface card, and a hard drive.

4. The method of claim 1 , wherein the computing device is a server.

5. The method of claim 1 , wherein the areas are defined within an interior of the computing device for containing respective expansion modules.

6. The method of claim 1 , further comprising determining expected power consumption based on vital product data of the expansion modules, and

wherein presenting indication of placement comprises presenting indication of placement of the expansion modules in the areas based on the determined expected power consumption.

7. The method of claim 1 , wherein presenting indication of placement comprises displaying information about where to place the expansion modules within the areas.

8. The method of claim 1 , further comprising storing information indicative of placement of expansion modules.

9. A method comprising:

determining airflow rates in areas available for operable connection of expansion modules within a computing device during operation of the computing device, wherein the areas available for operable connection includes a first area and a second area, wherein the expansion modules include a first expansion module and a second expansion module, the first expansion module having a higher expected power consumption than the second expansion module, and wherein determining airflow rates comprises determining that the first area has an airflow rate higher than the second area;

operating the computing device at a predetermined operating condition;

measuring actual power consumption of the expansion modules, wherein the actual power consumption is measured at the predetermined operating condition; and

presenting, on a user interface, indication that the first expansion module and the second expansion module are to be placed in the first area and the second area, respectively, based on the determined airflow rates and the measured actual power consumption measurement of the expansion modules.

10. A system comprising:

a computing device comprising at least one processor configured to execute program instructions to cause the computing device to:

operate the computing device at a predetermined operating condition;

measure actual power consumption of expansion modules in a first arrangement within areas of the computing device during operation of the computing device, wherein the areas are available for operable connection of expansion modules within the computing device during the operation of the computing device;

determine airflow rates in the areas available for operable connection of expansion modules within the computing device during operation of the computing device;

determine a second arrangement of the expansion modules within the areas based on the measured actual power consumption and the determined airflow rates and

present, on a user interface, indication of placement of the expansion modules in the second arrangement.

11. The system of claim 10 , further comprising a sensor configured to measure the airflow rates.

12. The system of claim 10 , wherein the areas available for operable connection includes a first area and a second area,

wherein the expansion modules include a first expansion module and a second expansion module, the first expansion module having a higher expected power consumption than the second expansion module,

wherein the at least one processor is configured to execute program instructions to cause the computing device to determine that the first area has an airflow rate higher than the second area, and

wherein the user interface indicates that the first expansion module and the second expansion module are to be placed in the first area and the second area, respectively.

13. The system of claim 10 , wherein an expansion module comprises one of a peripheral component interconnect (PCI)-compatible expansion module, a field-programmable gate array (FPGA), a graphics processing unit (GPU), a network interface card, and a hard drive.

14. The system of claim 10 , wherein the at least one processor is configured to execute program instructions to cause the computing device to determine expected power consumption based on one of vital product data of the expansion modules or a measure of actual power consumption of the expansion modules.

15. The system of claim 10 , wherein the user interface displays information about where to place the expansion modules within the areas.

16. The system of claim 10 , wherein the at least one processor is configured to execute program instructions to cause the computing device to store information indicative of placement of expansion modules.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 21, 2025
From: LENOVO GLOBAL TECHNOLOGIES INTERNATIONAL LIMITED
To: LENOVO GLOBAL TECHNOLOGIES SWITZERLAND INTERNATIONAL GMBH
Reel/Frame 070292/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 21, 2025
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE LTD.
To: LENOVO GLOBAL TECHNOLOGIES INTERNATIONAL LTD.
Reel/Frame 070292/0223 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 2, 2019
From: BARNETTE, JAMAICA LAQUAY; EVANS, DOUGLAS; TAILOR, DIPAK; TOTTEN, BRIAN CHRISTOPHER
To: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
Reel/Frame 049649/0283 →