Patent Assignment
Reel/Frame 049670/0197
Corrective Assignment to Correct the Assignee Name Sunedison Semiconductor Limited (Uen 201334164H) Previously Recorded on Reel 047419 Frame 0933. Assignor(S) Hereby Confirms the Assignment Filed Shows Globalwafers Co., Ltd. as the Assignee.
Recorded: 2019-01-17
Pages: 10
Assignors
LIBBERT, JEFFREY L.
Executed: 2018-08-23
LIU, QINGMIN
Executed: 2018-08-15
WANG, GANG
Executed: 2018-08-22
JONES, ANDREW M.
Executed: 2018-08-28
Assignee
GLOBALWAFERS CO., LTD.
NO. 8. INDUSTRIAL EAST ROAD, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, R.O.C., TAIWAN
Covered Properties
(2)
High Resistivity Silicon-on-Insulator Structure and Method of Manufacture Thereof
Patent:
10,468,295 →
Application:
15/828,534 →
Publication:
US 2018/0158721
PCT:
PCT/US2017/064248 ↗
High Resistivity Silicon-on-Insulator Structure and Method of Manufacture Thereof
Application:
62/429,922 →
Related Assignments
(1)
Other recorded transfers of the patents in this record — the chain of ownership.