Patent Assignment
Reel/Frame 049671/0719
Assignment of Assignor's Interest
Recorded: 2019-01-29
Pages: 5
Assignors
SU, YA-PING
Executed: 2018-10-16
FUNG, HAN-WEN
Executed: 2018-10-16
CHUNG, CHIA-CHI
Executed: 2018-10-17
HSU, CHIH-HSIEN
Executed: 2018-10-17
CHEN, CHUN YAN
Executed: 2018-10-16
WU, CHIEN-SHENG
Executed: 2018-10-16
HUANG, TIEN-CHIH
Executed: 2018-10-16
CHEN, WEI-DA
Executed: 2018-10-16
TSENG, CHIEN-HUA
Executed: 2018-10-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6, HSINCHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method of Forming a Semiconductor Device Comprising Top Conductive Pads