Patent Assignment
Reel/Frame 049673/0917
Assignment of Assignor's Interest
Recorded: 2019-07-05
Pages: 4
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Including Through Die via and Manufacturing Method Thereof