Patent Assignment
Reel/Frame 049673/0934
Assignment of Assignor's Interest
Recorded: 2019-07-05
Pages: 4
Assignors
TSAI, TSUNG-FU
Executed: 2019-06-19
LIN, SHIH-TING
Executed: 2019-06-19
LU, SZU-WEI
Executed: 2019-06-19
SHIH, YING-CHING
Executed: 2019-06-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method of Semiconductor Package Having Plurality of Encapsulating Materials