Patent Assignment
Reel/Frame 049689/0786
Assignment of Assignor's Interest
Recorded: 2019-07-08
Pages: 8
Assignors
CHO, HYUNG JUN
Executed: 2019-07-03
LEE, KYOUNG YEON
Executed: 2019-07-03
LEE, TAE YONG
Executed: 2019-07-03
BAE, JAE MIN
Executed: 2019-07-01
Assignee
AMKOR TECHNOLOGY KOREA, INC.
100, AMKOR-RO, BUK-GU, GWANGJU, 61006, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Having Component Mounted on Connection Bar and Lead on Top Side of Lead Frame and Method of Manufacturing Semiconductor Device Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.