Patent Assignment
Reel/Frame 049692/0363
Assignment of Assignor's Interest
Recorded: 2019-07-08
Pages: 3
Assignors
CHEN, TAI-YI
Executed: 2019-06-18
PENG, YUNG-CHOW
Executed: 2019-06-18
YANG, CHUNG-CHIEH
Executed: 2019-06-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Integrated Circuit Structure of Capacitive Device