IP Library Assignment 049704/0947
Patent Assignment
Reel/Frame 049704/0947

Assignment of Assignor's Interest

Recorded: 2019-07-09 Pages: 3
Assignor
PAHL, WOLFGANG
Executed: 2019-06-03
Assignee
TDK ELECTRONICS AG
ROSENHEIMER STRASSE 141E, MÜNCHEN, 81671, GERMANY
Covered Property (1)
Electronic Device with Stud Bumps
Application: 16/285,546 →
Publication: US 2019/0267318
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 30, 2020
From: TDK ELECTRONICS AG
To: TDK CORPORATION
Reel/Frame 054494/0914 →
Assignment of Assignor's Interest Oct 13, 2025
From: TDK CORPORATION
To: INVENSENSE, INC.
Reel/Frame 073080/0824 →