Patent Assignment
Reel/Frame 073080/0824
Assignment of Assignor's Interest
Recorded: 2025-10-13
Pages: 13
Assignor
TDK CORPORATION
Executed: 2025-10-07
Assignee
INVENSENSE, INC.
1745 TECHNOLOGY DRIVE, SUITE 100, SAN JOSE, CALIFORNIA, 95110
Covered Properties
(151)
High Efficiency Driver for Miniature Loudspeakers
Radio-Frequency Microelectromechanical Systems and Method of Manufacturing Such Systems
Microphone Comprising Integral Multi-Level Quantizer and Single-Bit Conversion Means
Electret Condenser Microphone
Miniature Microphone with Balanced Termination
Amplifier Circuit for Capacitive Transducers
Detection and Control of Diaphragm Collapse in Condenser Microphones
Microphone Assembly with P-Type Preamplifier Input Stage
Bonded Structure and Bonding Method
Connection Structure and Method for Fabricating the Same
Elastomeric Shield for Miniature Microphones
Electretization Method and Apparatus
Spring Structure for Mems Device
Electronic Device
Semiconductor Substrate, and Semiconductor Device and Method of Manufacturing the Semiconductor Device
Electrical Module with a Mems Microphone
Mems Microphone
Calibrated Microelectromechanical Microphone
Deep Sub-Micron Mos Preamplifier with Thick-Oxide Input Stage Transistor
Mems Tunable Device
Mems Microphone, Production Method and Method for Installing
Mems Package and Method for the Production Thereof
Shield Case and Mems Microphone Having It
Miniature microphone assembly with hydrophobic surface coating
Method of Fabricating an Ultra-Small Condenser Microphone
Method of Fabricating an Ultra-Small Condenser Microphone
Electret Condenser Microphone
Single Die Mems Acoustic Transducer and Manufacturing Method
Miniature Microphone Assembly with Solder Sealing Ring
Semiconductor Substrate
Microphone and Method for Fabricating the Same
Sensor Device and Fabrication Method for the Same
Component Comprising a Mems Microphone and Method for the Production of Said Component
Mems Device and Method for Manufacturing the Same
Microphone Assembly with Underfill Agent Having a Low Coefficient of Thermal Expansion
Board Mounting of Microphone Transducer
Semiconductor Substrate, and Semiconductor Device and Method of Manufacturing the Semiconductor Device
Method for Fabricating Semiconductor Device
Arrangement Comprising a Microphone
Bonded Structure and Bonding Method
Piezoelectric Body Module and Manufacturing Method Therefor
Mems Device, Mems Device Module and Acoustic Transducer
Diaphragm Structure and Mems Device
MEMS Component, Method for Producing a MEMS Component, and Method for Handling a MEMS Component
Method of Fabricating an Ultra-Small Condenser Microphone
Microphone Assembly with Integrated Self-Test Circuitry
Mems Device, Mems Device Module and Acoustic Transducer
Fast Precision Charge Pump
Semiconductor Chip Arrangement with Sensor Chip and Manufacturing Method
Method for Encapsulating an Mems Component
Mems-Microphone
Flat Back Plate
Component Comprising a Chip in a Cavity and a Stress-Reduced Attachment
Mems Package and Method for the Production Thereof
A Method of Manufacturing a Microphone
Sensor Module and Method for Producing Sensor Modules
Mems Microphone with Reduced Parasitic Capacitance
Mems-Microphone with Reduced Parasitic Capacitance
Mems Backplate, Mems Microphone Comprising a Mems Backplate and Method for Manufacturing a Mems Microphone
Mems Microphone
Microphone Arrangement
Miniaturized Electrical Component Comprising an MEMS and an ASIC and Production Method
Mems Microphone and Method for Manufacture
Electric Component Having a Shallow Physical Shape, and Method of Manufacture
Mems Microphone and Method for Producing the Mems Microphone
Microphone Arrangement
Mems Device Comprising an Under Bump Metallization
Microphone and Method to Position a Membrane Between Two Backplates
Assembly with an Analog Data Processing Unit and Method of Using Same
Mems Microphone and Method for Manufacture
Double Backplate Mems Microphone with a Single-Ended Amplifier Input Port
Differential Microphone and Method for Driving a Differential Microphone
Method for Producing a Sensor
Microphone with Automatic Bias Control
Mems Microphone Assembly and Method of Manufacturing the Mems Microphone Assembly
MEMS Microphone Assembly and Method of Operating the MEMS Microphone Assembly
Amplifier Circuit
MEMS Microphone And Method Of Operating The MEMS Microphone
Mems Component and Method for the Production Thereof
Top-Port MEMS Microphone and Method of Manufacturing the Same
Encapsulated Component Comprising a Mems Component and Method for the Production Thereof
Component Which Can Be Produced at Wafer Level and Method of Production
Method for Producing a Microelectromechanical Transducer
Method For Applying A Structured Coating To A Component
Multi-Mems Module
Condenser Microphone with Non-Circular Membrane
Electric Device, in Particular a Microphone Having Re-Adjustable Sensitivity, and Adjustment Method
Microphone Having Increased Rear Volume, and Method for Production Thereof
Microphone Arrangement
Mems Microphone and Method of Operating a Mems Microphone
Microphone Assembly and Method for Determining Parameters of a Transducer in a Microphone Assembly
Sensor Component Having Two Sensor Functions
Microphone Assembly and Method of Reducing a Temperature Dependency of a Microphone Assembly
Circuit and Method of Operating a Circuit
Microphone Assembly and Method of Manufacturing a Microphone Assembly
Microphone and Method for Producing a Microphone
Microphone and Method of Operating a Microphone
Electronic Circuit for a Microphone and Method of Operating a Microphone
Microphone and Method of Manufacturing a Microphone
Transducer Element and Mems Microphone
Mems Microphone Having Improved Sensitivity and Method for the Production Thereof
Housing for an Electric Component, and Method for Producing a Housing for an Electric Component
Module Comprising a Mems Component Mounted Without Subjecting Same to Stress
Impedance Circuit for a Charge Pump Arrangement and Charge Pump Arrangement
Integrated Circuit Arrangement for a Microphone, Microphone System and Method for Adjusting One or More Circuit Parameters of the Microphone System
Charge Pump Assembly
Mems Microphone with Improved Sensitivity
Sigma-Delta Modulator Arrangement, Method and Control Apparatus for Calibrating a Continuous-Time Sigma-Delta Modulator
Low-Dropout Voltage Regulator Apparatus
Electronic Circuit for a Microphone and Microphone
Top Port Microphone and Method for the Production of Same
Resiliently Mounted Sensor System with Damping
Integrated Circuit, Circuit Assembly and a Method for its Operation
Top Port Microphone with Enlarged Back Volume
Electronic Circuit for a Microphone and Microphone
Integrated Circuit, Circuit Assembly and a Method for its Operation
MEMS Capacitive Sensor
Negative Charge Pump and Audio Asic with Such Negative Charge Pump
Method for Calibrating a Microphone and Microphone
Mems Microphone and Method for Self-Calibration of the Mems Microphone
Electric Circuitry to Regulate a Bias Voltage for a Microphone
Electronic Device with Stud Bumps
Amplifier Circuit Arrangement and Method to Calibrate the Same
Microphone Array
Mems Device Stress-Reducing Structure
Low Noise Bandgap Reference Circuit and Method for Providing a Low Noise Reference Voltage
Carrier Substrate for Stress Sensitive Device and Method of Manufacture
MEMS Microphone And Method For Sensing Temperature
Method for Measuring a Behavior of a MEMS Device
Mems Microphone
Mems Microphone
Mems Device with Particle Filter and Method of Manufacture
Mems Microphone with Improved Particle Filter
Charge Pump and Microphone Circuit Arrangement
Analog-to-Digital Converter and Sensor Arrangement Including the Same
Oscillator Device
Robust Dual Membrane Microphone
MEMS Microphone and Method of Manufacture
Electronic Device and Method for Manufacturing an Electronic Device
Electronic Device with Stud Bumps
Mems Microphone Module
Device Having a Membrane and Method of Manufacture
Microelectromechanical Microphone Having a Stoppage Member
Microphone Component and Method for Fabricating Microphone Component
Microelectromechanical Microphone Having a Robust Backplate
Microelectromechanical Microphone with Membrane Trench Reinforcements and Method of Fabrication
Lid, MEMS Sensor Component and Methods of Manufacturing
Microelectromechanical Microphone with Membrane Trench Reinforcements and Method of Fabrication
Mems Sensor Package and Its Manufacturing Method
Application:
18/142,373 →
Publication:
US 2023/0365396
Microphone Component and Method for Fabricating Microphone Component
Microelectromechanical Microphone with Membrane Trench Reinforcements and Method of Fabrication
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 18, 2004
From: STENBERG, LARS JORN; MULLENBORN, MATTHIAS; MUCHA, IGOR
To: SONION A/S
Reel/Frame 015476/0473 →
Assignment of Assignor's Interest
Feb 4, 2005
From: FALLESEN, CARSTEN
To: SONION A/S
Reel/Frame 016255/0150 →
Assignment of Assignor's Interest
Feb 16, 2006
From: STENBERG, LARS JORN; POULSEN, JENS KRISTIAN; VAN HALTEREN, AART ZEGER
To: SONION A/S
Reel/Frame 017263/0642 →
Assignment of Assignor's Interest
May 23, 2006
From: POULSEN, JENS KRISTIAN
To: SONION A/S
Reel/Frame 017919/0588 →
Assignment of Assignor's Interest
Jul 6, 2006
From: STENBERG, LARS J.; FALLESEN, CARSTEN
To: SONION A/S
Reel/Frame 018086/0383 →
Assignment of Assignor's Interest
Dec 5, 2006
From: MINAMIO, MASANORI; FUJIMOTO, HIROAKI; MIZUTANI, ATSUHITO; FUJITANI, HISAKI
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 018585/0676 →
Assignment of Assignor's Interest
Mar 13, 2007
From: MINAMIO, MASANORI; FUJIMOTO, HIROAKI; MIZUTANI, ATSUHITO; FUJITANI, HISAKI
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 019003/0094 →
Assignment of Assignor's Interest
Apr 20, 2007
From: WILK, CHRISTOPHER; BOVSBJERG, BJARKE PIHL; LIUSVAARA, TAPIO JUHANI
To: SONION MEMS A/S
Reel/Frame 019209/0112 →
Assignment of Assignor's Interest
Jul 12, 2007
From: TAKEUCHI, YUSUKE; OGURA, HIROSHI
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 019551/0349 →
Assignment of Assignor's Interest
Aug 17, 2007
From: KUMAKAWA, TAKAHIRO
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 019712/0527 →
Assignment of Assignor's Interest
Aug 17, 2007
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 019719/0843 →
Assignment of Assignor's Interest
Aug 28, 2007
From: OGURA, HIROSHI; YAMAOKA, TOHRU
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 019755/0144 →
Assignment of Assignor's Interest
Nov 12, 2007
From: STEENEKEN, PETER G.; VAN BEEK, JOZEF THOMAS MARTINUS; RIJKS, THEO
To: NXP B.V.
Reel/Frame 020097/0507 →
Assignment of Assignor's Interest
Dec 5, 2007
From: SONION TECH A/S
To: SONION A/S
Reel/Frame 020241/0552 →
Assignment of Assignor's Interest
Jan 9, 2008
From: LEIDL, ANTON; PAHL, WOLFGANG; WOLFF, ULRICH
To: EPCOS AG
Reel/Frame 020338/0820 →
Assignment of Assignor's Interest
Mar 31, 2008
From: DEN TOONDER, JACOB M., J.; VAN DIJKEN, AUKE R.; RIJKS, THEODOOR G., S., M.; VAN BEEK, JOZEF T., M.
To: NXP B.V.
Reel/Frame 020729/0650 →
Assignment of Assignor's Interest
Jun 24, 2008
From: LEIDL, ANTON; PAHL, WOLFGANG; WOLFF, ULRICH
To: EPCOS AG
Reel/Frame 021145/0480 →
Change of Name
Nov 20, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021897/0534 →
Change of Name
Nov 21, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021897/0588 →
Change of Name
Nov 24, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021897/0671 →
Assignment of Assignor's Interest
Dec 10, 2008
From: STEENEKEN, PETER G.; VAN BEEK, JOZEF THOMAS MARTINUS; RIJKS, THEODOOR G.S.M.
To: EPCOS AG
Reel/Frame 021951/0982 →
Assignment of Assignor's Interest
Jan 28, 2010
From: NXP B.V.
To: EPCOS AG
Reel/Frame 023862/0284 →
Change of Name
Mar 11, 2013
From: PULSE MEMS A/S
To: PULSE MEMS APS
Reel/Frame 029967/0899 →
Change of Name
Mar 11, 2013
From: SONION MEMS A/S
To: PULSE MEMS A/S
Reel/Frame 029967/0872 →
Assignment of Assignor's Interest
Mar 11, 2013
From: PULSE MEMS APS
To: EPCOS PTE LTD
Reel/Frame 029966/0907 →