Sensor component having two sensor functions
A sensor component having a MEMS sensor and an ASIC for one sensor function each. A base element, a wall element in the form of a frame and a cover together enclose a cavity of a housing. The MEMS sensor is mounted inside the cavity on the base element of the housing. The ASIC has an active sensor surface and is mounted on or under the cover or is embedded in the cover. Electrical external contacts for the MEMS sensor and ASIC are provided on an external surface of the housing. The cavity has at least one opening or bushing.
1. A sensor component
having a first and a second sensor element for a respective sensor function,
having a housing that has a base element, a wall element in the form of a frame and a cover, which together enclose a cavity,
in which the first sensor element is an MEMS sensor and is mounted inside the cavity on the base element of the housing,
in which the second sensor element is in the form of an ASIC having an active sensor area and is mounted on or under the cover or embedded in the cover,
in which the active sensor area of the second sensor element is accessible from the inside of the housing,
in which electrical outer contacts are provided on an outer area of the housing,
in which the housing has a bushing that connects the inside of the housing to the surroundings outside the housing to provide access of surroundings to the MEMS sensor and the active sensor area of the second sensor element as well,
in which the MEMS sensor is mounted without tension on spring contact elements that connect the contact areas of the MEMS sensor to inner pads on the inside of the base element, in which at least one sensor function is integrated on or in the ASIC and in which the ASIC generates an output value.
2. The sensor component according to claim 1 ,
in which the first sensor element is an MEMS pressure sensor.
3. The sensor component according to claim 1 ,
in which the cover comprises a printed circuit board having an integrated circuitry,
in which the electrical connection between the ASIC on the printed circuit board and the electrical outer contacts runs within the wall element and through the base element.
4. The sensor component according to claim 1 ,
in which only one opening or only one bushing is formed in the base element beneath the first sensor element that connects the two sensor elements to the surroundings outside the housing.
5. The sensor component according to claim 1 ,
in which the second sensor element is a temperature sensor and/or a moisture sensor.