Calibrated microelectromechanical microphone

1. A MEMS microphone assembly including a microphone housing, the MEMS microphone assembly comprising:

a sound inlet;

a MEMS transducer element having a back plate and a diaphragm displaceable in relation to the back plate;

a controllable bias voltage generator adapted to provide a DC bias voltage between the diaphragm and the back plate;

a memory for storing information including amplifier gain setting information;

a controllable amplifier for receiving an electrical signal from the MEMS transducer element and providing an output signal, the controllable amplifier being adapted to amplify the electrical signal from the MEMS transducer in accordance with an amplifier gain setting; and

a processor adapted to retrieve information from the memory and to

control the gain of the amplifier in accordance with the amplifier gain setting information from the memory, and

control the bias voltage generator to provide a DC bias voltage in accordance with the information from the memory.

2. A MEMS microphone assembly according to claim 1 , wherein the MEMS transducer element has a distance from the back plate to the diaphragm in the range of 1-10 μm, such as 2-5 μm.

3. A MEMS microphone assembly according to claim 1 , wherein the controllable bias voltage generator is adapted to generate a DC bias voltage in the range of 5-20 V.

4. A MEMS microphone assembly according to claim 1 , wherein the memory comprises memory circuitry of a type of the group consisting of: RAM, PROM, EPROM, EEPROM, flash, one-time-programmable memories, and memories based on fuse-link technology.

5. A method of calibrating a MEMS microphone assembly comprising a MEMS transducer element, the method comprising the steps of:

measuring or estimating a collapse voltage of the MEMS transducer element;

determining a DC bias voltage for the MEMS transducer element on the basis of the measured or estimated collapse voltage; and

writing information relating to the determined DC bias voltage to a memory of the microphone assembly.

6. A method according to claim 5 , wherein measuring/estimating step comprises the steps of:

applying a DC bias voltage to the MEMS transducer element,

applying a predetermined sound pressure to the MEMS transducer element,

measuring an acoustic sensitivity of the MEMS transducer element during the application of the DC bias voltage and the predetermined sound pressure, and

determining the collapse voltage based on the measured sensitivity and the applied DC bias voltage.

7. A method according to claim 5 , wherein the measuring/estimating step comprises the steps of:

increasing a voltage provided between the back plate and the diaphragm of the MEMS transducer element while monitoring a capacitance value between the back plate and the diaphragm, until, at a first voltage, a predetermined increase in the capacitance value is detected, and

estimating the collapse voltage on the basis of the first voltage.

8. A method according to claim 5 , further comprising the steps of:

applying a DC voltage corresponding to the determined DC bias voltage to the MEMS transducer element,

applying a predetermined sound pressure to the MEMS transducer element,

amplifying, in an amplifier, a signal output of the MEMS transducer element in response to the sound pressure, and outputting an amplified signal,

determining, on the basis of the amplified signal and a predetermined signal parameter, an amplifier gain setting, and

writing information relating to the determined amplifier gain setting to the memory.

9. A method according to claim 8 , further comprising the step of electrically interconnecting the MEMS transducer element and the amplifier permanently on a common substrate carrier before performing the step of determining the amplifier gain setting.

10. A method according to claim 5 , wherein the step of measuring or estimating a collapse voltage of the MEMS transducer element is performed on a MEMS microphone wafer comprising a plurality of MEMS microphones.

11. A method according to claim 10 , wherein the collapse voltage of the MEMS transducer element is estimated from a MEMS transducer subset of the plurality of MEMS transducers.

12. A method of calibrating a plurality of MEMS microphone assemblies, the method comprising:

providing a plurality of MEMS transducer elements from a single wafer batch or a single wafer,

providing a MEMS transducer element in each microphone assembly;

calibrating a subset of the plurality of MEMS microphone assemblies in accordance with the method of claim 5 and deriving DC bias voltage information there from; and

writing at least the derived DC bias voltage information to respective memories of the remaining MEMS microphone assemblies of the plurality of MEMS microphone assemblies.