Patent Assignment
Reel/Frame 041132/0144
Assignment of Assignor's Interest
Recorded: 2017-01-31
Pages: 7
Assignor
EPCOS PTE LTD
Executed: 2016-11-01
Assignee
TDK CORPORATION
3-9-1 SHIBAURA, MINATO-KU, TOKYO, 108-0023, JAPAN
Covered Properties
(30)
Flexible Substrate Transducer Assembly
Patent:
6,324,907 →
Application:
09/450,994 →
Silicon-Based Sensor System
Patent:
6,522,762 →
Application:
09/570,434 →
Pressure Transducer
Patent:
6,732,588 →
Application:
09/570,493 →
Method of Manufacturing a Transducer Having a Diaphragm with a Predetermined Tension
Patent:
6,622,368 →
Application:
09/719,208 →
Sigma Delta Modulator Having Enlarged Dynamic Range Due to Stabilized Signal Swing
Patent:
6,831,577 →
Application:
10/059,270 →
Solid State Silicon-Based Condenser Microphone
Patent:
42,346 →
Application:
10/193,055 →
High Efficiency Driver for Miniature Loudspeakers
Surface Mountable Transducer System
Silicon-Based Transducer for Use in Hearing Instruments and Listening Devices
Microphone Comprising Integral Multi-Level Quantizer and Single-Bit Conversion Means
Miniature Microphone with Balanced Termination
Amplifier Circuit for Capacitive Transducers
Detection and Control of Diaphragm Collapse in Condenser Microphones
Surface Mountable Transducer System
Microphone Assembly with P-Type Preamplifier Input Stage
Method of Providing a Hydrophobic Layer and Condenser Microphone Having Such a Layer
Patent:
40,781 →
Application:
11/502,577 →
Silicon-Based Transducer for Use in Hearing Instruments and Listening Devices
Elastomeric Shield for Miniature Microphones
Surface Mountable Transducer System
Solid State Silicon-Based Condenser Microphone
Patent:
42,347 →
Application:
11/903,207 →
Calibrated Microelectromechanical Microphone
Deep Sub-Micron Mos Preamplifier with Thick-Oxide Input Stage Transistor
Miniature microphone assembly with hydrophobic surface coating
Single Die Mems Acoustic Transducer and Manufacturing Method
Miniature Microphone Assembly with Solder Sealing Ring
Microphone Assembly with Underfill Agent Having a Low Coefficient of Thermal Expansion
Board Mounting of Microphone Transducer
Microphone unit with internal A/D converter
Microphone Assembly with Integrated Self-Test Circuitry
Fast Precision Charge Pump
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 12, 2004
From: SONIONTECH A/S
To: SONION A/S
Reel/Frame 015875/0265 →
Assignment of Assignor's Interest
Feb 4, 2005
From: FALLESEN, CARSTEN
To: SONION A/S
Reel/Frame 016255/0150 →
Assignment of Assignor's Interest
May 23, 2006
From: POULSEN, JENS KRISTIAN
To: SONION A/S
Reel/Frame 017919/0588 →
Assignment of Assignor's Interest
Jul 6, 2006
From: STENBERG, LARS J.; FALLESEN, CARSTEN
To: SONION A/S
Reel/Frame 018086/0383 →
Change of Name
Jul 24, 2006
From: MICROTRONIC A/S
To: SONION ROSKILDE A/S
Reel/Frame 018266/0337 →
Change of Name
Oct 12, 2006
From: SONIONMEMS A/S
To: SONION MEMS A/S
Reel/Frame 018392/0681 →
Assignment of Assignor's Interest
Apr 20, 2007
From: WILK, CHRISTOPHER; BOVSBJERG, BJARKE PIHL; LIUSVAARA, TAPIO JUHANI
To: SONION MEMS A/S
Reel/Frame 019209/0112 →
Corrected Cover Sheet to Correct Assignee Information, Previously Recorded at Reel/Frame 018266/0337 (Assignment of Assignor's Interest)
Jun 11, 2007
From: SONION ROSKILDE A/S
To: SONION MEMS A/S
Reel/Frame 019430/0514 →
Correction to the Assignee on Reel/Frame 018266/0337
Jun 28, 2007
From: SONION ROSKILDE A/S
To: SONION MEMS A/S
Reel/Frame 019493/0898 →
Assignment of Assignor's Interest
Nov 1, 2007
From: COMPUDIGM INTERNATIONAL LIMITED
To: BALLY TECHNOLOGIES, INC.
Reel/Frame 020054/0661 →
Assignment of Assignor's Interest
Dec 5, 2007
From: SONION TECH A/S
To: SONION A/S
Reel/Frame 020241/0552 →
Assignment of Assignor's Interest
Feb 13, 2008
From: MULLENBORN, MATTHIAS; VAN HALTEREN, AART Z.
To: SONIONMEMS A/S
Reel/Frame 020564/0451 →
Change of Name
Apr 16, 2008
From: SONIONMEMS A/S
To: SONION MEMS A/S
Reel/Frame 020815/0080 →
Corrective of April 16,2008 Recordaton to Include Supporting Document.
May 9, 2008
From: SONIONMEMS A/S
To: SONION MEMS A/S
Reel/Frame 020956/0422 →
Assignment of Assignor's Interest
Feb 20, 2009
From: COMPUDIGM INTERNATIONAL LIMITED
To: BALLY TECHNOLOGIES, INC.
Reel/Frame 022288/0300 →
Change of Name
Mar 2, 2010
From: SONIONMEMS A/S
To: SONION MEMS A/S
Reel/Frame 024014/0196 →
Change of Name
Mar 11, 2013
From: PULSE MEMS A/S
To: PULSE MEMS APS
Reel/Frame 029967/0899 →
Change of Name
Mar 11, 2013
From: SONIONMEMS A/S
To: SONION MEMS A/S
Reel/Frame 029967/0935 →
Change of Name
Mar 11, 2013
From: SONION MEMS A/S
To: PULSE MEMS A/S
Reel/Frame 029967/0872 →
Assignment of Assignor's Interest
Mar 11, 2013
From: PULSE MEMS APS
To: EPCOS PTE LTD
Reel/Frame 029966/0907 →
Change of Name
May 16, 2013
From: SONION A/S
To: PULSE COMPONENTS APS
Reel/Frame 030440/0135 →
Assignment of Assignor's Interest
May 16, 2013
From: PULSE COMPONENTS APS
To: EPCOS PTE LTD
Reel/Frame 030431/0087 →
Change of Name
Jun 29, 2013
From: SONION MEMS A/S
To: PULSE MEMS A/S
Reel/Frame 030743/0195 →
Change of Name
Jun 29, 2013
From: PULSE MEMS A/S
To: PULSE MEMS APS
Reel/Frame 030743/0232 →
Asset Transfer Agreement
Jun 29, 2013
From: PULSE MEMS APS
To: EPCOS PTE LTD
Reel/Frame 030743/0262 →